Consolation prize for Best Poster

Award Description: 
“Effect of additives on the Co-electrodeposition of Sn-Ag-Cu lead-free Solder Composition” by Shany Joseph and Girish .J. Phatak , 2nd Int. Symp. on Advanced materials and Polymers for Aerospace & Defence Applications (SAMPADA2008), Pune, Dec. 8-12, 2008
Awarded By: 
SAMPADA-2008
Award Location: 
Pune Laboratory
Award Year: 
2008
Award Type: 
National Award