PN/SP/013

Project Type: 
Sponsored Project
Project Name: 
Technology Demonstration of Multilayer LTCC Packages for MEMS application
Objective/Description: 

The aim of this project was to set-up the LTCC fabrication facility at C-MET, Pune and demonstrate prototype/small volume fabrication of ceramic packages using LTCC process for application specific high reliability packaging including MEMS application

Sponsored by: 
National Program on Smart Materials
Project Cost: 
Rs 5,25,90,000/-
Project Start: 
15/12/2003
Project End: 
14/12/2005
Project Extended: 
31/07/2006
ProjectHead: 
Project Location: 
Pune Laboratory
Project Status: 
Completed