Recognizing the importance of the SMT, C-MET has developed solder paste required for the attachment of components to the Printed Circuit Board. The product is at par with the international standards. C-MET’s solder paste passes the IPC standard IPC-SP-819.
C-MET’s Solder Paste composition is available to prospective manufacturers for commercial use, at cost on non-exclusive basis. The interested parties may contact the Executive Director, C-MET.
PROPERTYCMET Solder PasteType Application method Shelf life Solder PowderRMA
Dispensing(syringe) or stencil printing Over six months (at 4oC)
Commonly used cleaning solvents, such as, IPA 300-400KcPs for dispensing and ~600kcPs for stencil printing
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