Award Description:
“Lead-free Photoimageable Silver Conductor Paste Formulation for High Density Electronic Packaging” by S.A. Ketkar, G. Umarji, J. Ambekar, G.J. Phatak, U.P. Mulik and D.P. Amalnerkar, in the conference IUMRS-ICMAT-2005 held in Singapore during July 3-8, 2005
Awarded By:
IUMRS-ICMAT- held in Singapore