Expression of Interest for the identification of Development cum Production industry (DcPP) partners for the joint submission of a project towards the Development of Advanced Photonics Packaging Technologies using Additive Manufacturing

The objective of this Expression of Interest (EOI) is to identify and empanel suitable Indian Industry Partners, Start-ups, MSMEs, OEMs, System Integrators, Research Organizations, and End Users for participation as Development-cum-Production Partners (DcPPs) in the proposed project entitled “Establishment of Additive Packaging Center (A-PACK Center) at C-MET, Pune (Phase-2 Technology Development)”.